IBM Corp. and GlobalFoundries Inc. announced today that they’ve agreed to end a years-long legal dispute that focused on ...

IBMの2nmノードのチップは、500億個以上のトランジスターを集積できます。CPOテクノロジーは、チップメーカーがアクセラレーター間に電気配線の ...

IBM's SOI technology can provide up to a 30 percent chip performance improvement and 40 percent power reduction ... Embedded memory is a key performance enabler for multi-core processors and other ...

Following successful early demonstrations of linking two quantum computing chips, IBM is aiming to break records for the ...

IBM Research has developed co-packaged optics, new chip assembly and packaging advancements ... The new optics technology could prove more efficient in an era of energy- and bandwidth-intensive ...

IBM and Globalfoundries sued each other for breach of contract. They have now reached an out-of-court settlement.

GlobalFoundries and IBM settle all litigations, including those that covered IBM's work with Intel and Rapidus.

GlobalFoundries and IBM reported this week that they settled two lawsuits accusing GlobalFoundries of breach of contract with ...

The legal dispute stems from GlobalFoundries' takeover of IBM’s loss-making chip business in 2015. The deal saw IBM pay GF $1 ...

IBM and semiconductor maker GlobalFoundries have settled all of their litigation against each other, including breach of ...

Following two lawsuits in 2021 and 2023, IBM and Global Foundries have reached a settlement, but it's not known exactly what.

In a technical paper, IBM introduces a new CPO prototype module that can enable high-speed optical connectivity. This technology could significantly increase the bandwidth of data center ...